Active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices

ABSTRACT

A NAND flash memory device incorporates a unique booster plate design. The booster plate is biased during read and program operations and the coupling to the floating gates in many cases reduces the voltage levels necessary to program and read the charge stored in the gates. The booster plate also shields against unwanted coupling between floating gates. Self boosting, local self boosting, and erase area self boosting modes used with the unique booster plate further improve read/write reliability and accuracy. A more compact and reliable memory device can hence be realized according to the present invention.

CROSS REFERENCE TO RELATED APPLICATIONS

The present invention is related to an application filed Dec. 27, 2005,U.S. patent application Ser. No. 11/319,260 by Tuan D. Pham et al.,entitled “Methods for Active Boosting to Minimize Capacitive CouplingEffect Between Adjacent Gates of Flash Memory Devices” and U.S. patentapplication Ser. No. 10/774,014 entitled “Self-Boosting System for FlashMemory Cells” to Hemink et al., which are hereby incorporated by thisreference in their entirety, as are all patents and applicationsreferred to in the present application.

FIELD OF THE INVENTION

This invention relates generally to non-volatile semiconductor memoriesof the flash EEPROM (Electrically Erasable and Programmable Read OnlyMemory) type, particularly to structures and methods of operating NANDtypes of memory cell arrays.

BACKGROUND OF THE INVENTION

There are many commercially successful non-volatile memory productsbeing used today, particularly in the form of small form factor cards,which use an array of flash EEPROM cells.

One popular flash EEPROM architecture utilizes a NAND array, wherein alarge number of strings of memory cells are connected through one ormore select transistors between individual bit lines (“BLs”) and areference potential. NAND arrays are well known in the art and arewidely utilized in various consumer devices at this time. A portion ofsuch an array is shown in plan view in FIG. 2A. BL0-BL4 (of whichBL1-BL3 are also labeled 12-16) represent diffused bit line connectionsto global vertical metal bit lines (not shown). Although four floatinggate memory cells are shown in each string, the individual stringstypically include 16, 32 or more memory cell charge storage elements,such as floating gates, in a column. Control gate (word) lines labeledWL0-WL3 (labeled P2 in FIG. 2B, a cross-sectional along line A-A of FIG.2A) and string selection lines SGD and SGS extend across multiplestrings over rows of floating gates, often in polysilicon (labeled P1 inFIG. 2B). However, for transistors 40 and 50, the control gate andfloating gate may be electrically connected (not shown). The controlgate lines are typically formed over the floating gates as aself-aligned stack, and are capacitively coupled with each other throughan intermediate dielectric layer 19, as shown in FIG. 2B. The top andbottom of the string connect to the bit line and a common source linerespectively, commonly through a transistor using the floating gatematerial (P1) as its active gate electrically driven from the periphery.This capacitive coupling between the floating gate and the control gateallows the voltage of the floating gate to be raised by increasing thevoltage on the control gate coupled thereto. An individual cell within acolumn is read and verified during programming by causing the remainingcells in the string to be turned on by placing a relatively high voltageon their respective word lines and by placing a relatively lower voltageon the one selected word line so that the current flowing through eachstring is primarily dependent only upon the level of charge stored inthe addressed cell below the selected word line. That current typicallyis sensed for a large number of strings in parallel, in order to readcharge level states along a row of floating gates in parallel.

Relevant examples of NAND type flash memories and their operation areprovided in the following U.S. Patents/Patent Applications, all of whichare incorporated herein by reference in their entirety: U.S. Pat. Nos.5,570,315; 5,774,397; 6,046,935, 6,456,528 and 6,522,580.

The charge storage elements of current flash EEPROM arrays are mostcommonly electrically conductive floating gates, typically formed fromdoped polysilicon material. However, other materials with charge storingcapabilities, that are not necessarily electrically conductive, can beused as well. An example of such an alternative material is siliconnitride. Such a cell is described in an article by Takaaki Nozaki etal., “A 1-Mb EEPROM with MONOS Memory Cell for Semiconductor DiskApplication” IEEE Journal of Solid-State Circuits, Vol. 26, No. 4, Apr.1991, pp. 497-501.

Memory cells of a typical non-volatile flash array are divided intodiscrete blocks of cells that are erased together. That is, the blockcontains the minimum number of cells that are separately erasabletogether as an erase unit, although more than one block may be erased ina single erasing operation. Each block typically stores one or morepages of data, a page defined as the minimum number of cells that aresimultaneously subjected to a data programming and read operation as thebasic unit of programming and reading, although more than one page maybe programmed or read in a single operation. Each page typically storesone or more sectors of data, the size of the sector being defined by thehost system. An example is a sector of 512 byes of user data, followinga standard established with magnetic disk drives, plus some number ofbytes of overhead information about the user data and/or the block inwhich it is stored.

As in most all integrated circuit applications, the pressure to shrinkthe silicon substrate area required to implement some integrated circuitfunction also exists with flash EEPROM arrays. It is continually desiredto increase the amount of digital data that can be stored in a givenarea of a silicon substrate, in order to increase the storage capacityof a given size memory card and other types of packages, or to bothincrease capacity and decrease size. Another way to increase the storagedensity of data is to store more than one bit of data per memory cellcharge storage element. This is accomplished by dividing the allowablevoltage or charge storage window of a charge storage element into morethan two states. The use of four such states allows each cell to storetwo bits of data, eight states stores three bits of data per cell, andso on. Operation of a multiple state flash EEPROM structure is describedin U.S. Pat. Nos. 5,043,940; 5,172,338 ,5,570,315 and 6,046,935.

A typical architecture for a flash memory system using a NAND structurewill include NAND arrays, where each array includes several NANDstrings. For example, FIG. 3A shows only three NAND strings 11, 13 and15 of the memory array of FIG. 2A, which array contains more than threeNAND strings. Each of the NAND strings of FIG. 3A includes two selecttransistors and four memory cells. For example, NAND string 11 includesselect transistors 20 and 30, and memory cells 22, 24, 26 and 28. NANDstring 13 includes select transistors 40 and 50, and memory cells 42,44, 46 and 48. Each string is connected to the source line by its selecttransistor (e.g. select transistor 30 and select transistor 50). Aselection line SGS is used to control the source side select gates. Thevarious NAND strings are connected to respective bit lines by selecttransistors 20, 40, etc., which are controlled by select line SGD. Inother embodiments, the select lines do not necessarily need to be incommon. Word line WL3 is connected to the control gates for memory cell22 and memory cell 42. Word line WL2 is connected to the control gatesfor memory cell 24 and memory cell 44. Word line WL1 is connected to thecontrol gates for memory cell 26 and memory cell 46. Word line WL0 isconnected to the control gates for memory cell 28 and memory cell 48. Ascan be seen, each bit line and the respective NAND string comprise thecolumns of the array of memory cells. The word lines (WL3, WL2, WL1 andWL0) comprise the rows of the array. Each word line connects the controlgates of each memory cell in the row. For example, word line WL2 isconnected to the control gates for memory cells 24, 44, and 64.

FIG. 3B is a circuit diagram depicting a number of NAND arrays, witheach array controlled by a set of common word lines. The array of FIGS.2A and 3 appears as the top array in FIG. 3B. As shown in FIG. 3B, eachNAND string (e.g. 11, 13) in the same array is connected to one of aplurality of bit lines 12, 14, . . . and to a common source line, andare controlled by a common set of word lines (WL0-WL3).

Each memory cell can store data (analog or digital). When storing onebit of digital data (binary memory cell), the range of possiblethreshold voltages of the memory cell is divided into two ranges whichare assigned logical data “1” and “0”. In one example of a NAND typeflash memory, the voltage threshold is negative after the memory cell iserased, and defined as logic “1.” The threshold voltage after a programoperation is positive and defined as logic “0.” When the thresholdvoltage is negative and a read is attempted with 0 volt applied to itscontrol gate, the memory cell will conduct current to indicate logic oneis being stored. When the threshold voltage is positive and a readoperation is attempted, the memory cell will not turn on, whichindicates that logic zero is stored. A memory cell can also storemultiple levels of information, for example, multiple bits of digitaldata. In the case of storing multiple levels of data, the range ofpossible threshold voltages is divided into the number of levels ofdata. For example, if four levels of information are stored, there willbe four threshold voltage ranges, each range assigned to one data value.Memories storing data by differentiation between multiple (i.e. morethan two) ranges of threshold voltage are known as multiple statememories. In one example of a NAND type memory, the threshold voltageafter an erase operation is negative and defined as “11”. Positivethreshold voltages are used for the states of “10”, “01”, and “00.”

When programming a NAND flash memory cell, a program voltage is appliedto the control gate and the channel area of the NAND string that isselected for programming is grounded (0V). Electrons from the channelarea under the NAND string are injected into the floating gate. Whenelectrons accumulate in the floating gate, the floating gate becomesnegatively charged and the threshold voltage of the cell is raised. Toground the channel area of the selected NAND string, the correspondingbitline is grounded (0 volt), while the SGD is connected to asufficiently high voltage (typically V_(dd) at for example 3.3 volts)that is higher than the threshold voltage of the select transistors. Toapply the program voltage to the control gate of the cell beingprogrammed, that program voltage is applied on the appropriate wordline. As discussed above, that word line is also connected to one cellin each of the other NAND strings that utilize the same word line. Forexample, when programming cell 24 of FIG. 3A, the program voltage willalso be applied to the control gate of cell 44 because both cells sharethe same word line. A problem arises when it is desired to program onecell on a word line without programming other cells connected to thesame word line, for example, when it is desired to program cell 24 andnot cell 44. Because the program voltage is applied to all cellsconnected to a word line, an unselected cell (a cell that is not to beprogrammed) on the word line may become inadvertently programmed. Forexample, cell 44 is adjacent to cell 24. When programming cell 24, thereis a concern that cell 44 might unintentionally be programmed. Theunintentional programming of the unselected cell on the selected wordline is referred to as “program disturb.” More generally speaking,“program disturb” is used to describe any unwanted threshold voltageshift, either in the positive or negative direction, which can occurduring a programming operation and is not necessarily limited to theselected word line.

Several techniques can be employed to prevent program disturb. Onemethod known as “self boosting” (“SB”) is proposed by K. D. Suh et al.in “A 3.3 V 32 Mb NAND Flash Memory with Incremental Step PulseProgramming Scheme,” Journal of Solid-State Circuits, Vol 30, No. 11,Nov. 1995, pp. 1149-55. During programming using the SB scheme, thechannel areas of the unselected NAND strings are electrically isolatedfrom their corresponding bit lines. Subsequently an intermediate passvoltage (e.g. 10 volts) is applied to the unselected word lines while ahigh program voltage (e.g. 18 volts) is applied to the selected wordline. The channel areas of the unselected NAND strings are capacitivelycoupled to the unselected word lines, causing a voltage (e.g. six volts,assuming a coupling ratio of 0.6) to exist in the channel areas of theunselected NAND strings. This so called “Self Boosting” reduces thepotential difference between the channel areas of the unselected NANDstrings and the program voltage that is applied to the selected wordline. As a result, for the memory cells in the unselected NAND stringsand especially for the memory cells in such strings on the selected wordline, the voltage across the tunnel oxide and hence the program disturbare significantly reduced. For more information regarding NAND arraysand boosting, please refer to U.S. patent application Ser. No.10/774,014 to Gertjan Hemink, which is hereby incorporated by referencein its entirety.

A NAND string is typically (but not always) programmed from the sourceside to the drain side, for example, from memory cell 28 to memory cell22. When the programming process is ready to program the last (or nearthe last) memory cell of the NAND string, if all or most of thepreviously programmed cells on the string being inhibited (e.g. string13) were programmed, then there is negative charge in the floating gatesof the previously programmed cells. Because of this negative charge onthe floating gates, the pre-charging can not take place completely,resulting in a lower initial potential of the channel area under theNAND string and the subsequent self-boosting of such channel areabecomes less effective as well. Therefore, the boosted potential in thechannels of the unselected NAND strings may not become high enough andthere still may be program disturb on the last few word lines. Forexample, when programming voltage is applied to WL3, if cells 48, 46,and 44 on a string that is inhibited were programmed, then each of thosememory cells 44, 46, 48 has a negative charge on its floating gate whichwill limit the boosting level of the self boosting process and possiblycause program disturb on cell 42.

In view of the above problem, as an improvement, T. S. Jung et al.proposed a local self boosting (“LSB”) technique in “A 3.3V 128 MbMulti-Level NAND Flash Memory for Mass Storage Applications”, ISSCC96,Session 2, Flash Memory, Paper TP 2.1, IEEE, pp. 32.

In the LSB scheme, when applying a high programming voltage to the wordline WL2, in order to reduce or prevent program disturb in regard tomemory cell 44 on a string that is inhibited, 0 volts are applied toword lines WL1 and WL3 so that memory cells 42 and 46 are turned off.Then the channel potential in memory cell 44 is not or at least lessinfluenced by the self boosting in the channel regions of memory cells42, 46, and 48. Therefore, the channel potential of the channel regionof memory cell 44 may be self boosted by the high programming voltageVpgm to a voltage level that is higher than that achieved when thechannel region of memory cell 44 is influenced by the self boosting inthe remaining memory cells 42, 46, and 48. This prevents program disturbwhen memory cell 24 is being programmed. For a more detailed explanationof self boosting and local self boosting, please see U.S. Pat. No.6,107,658, especially the description in columns 6-10.

Another technique proposed as an alternative to local self boosting isdescribed in U.S. Pat. No. 6,525,964 to Tanaka et al. and is known aserased area self boosting (“EASB”). EASB differs from LSB in that,instead of turning off both memory cells on either side of theunselected cell to prevent program disturb of the cell as in LSB, EASBturns off only the memory cell on the source side of the unselectedcell. For example, where memory cell 24 is being programmed, only memorycell 46 is being turned off without turning off memory cell 42, in orderto prevent program disturb at cell 44.

While LSB and EASB maybe advantageous for many applications, certainproblems are still encountered when these schemes are used in theircurrent form, especially when the memory cell dimensions of futuregeneration devices are continually reduced or scaled down. It istherefore desirable to provide improved boosting structures and schemes.

SUMMARY OF THE INVENTION

A NAND memory device made according to the present invention is lesssubject to errors in programming and reading, and can also be made morecompact at the same time. A booster plate with fingers than run betweenbut not above the wordlines provides coupling that is advantageous tooperations without producing excessive coupling to the top of thewordlines, which can be detrimental to operations. Elimination ofunwanted coupling between adjacent cells minimizes undesired shiftsabove or below voltage thresholds. This is especially important inmulti-level applications where the levels are closely spaced. Theprocesses used in making the booster plate and the device in which it isused are also described.

When combined with unique boosting methods, the combination of the plateand the methods minimizes the noise that might otherwise be present, andallows for lesser voltage levels to be utilized, when appropriate. Thisminimizes disturbs. These methods include self boost modes, local selfboost modes, and erase area self boost modes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross section of device 100, an embodiment of the presentinvention.

FIG. 2A is a plan view of a prior art memory array or device presentedto provide background on how NAND flash memory devices operate.

FIG. 2B is a cross section of the prior art memory array shown in FIG.2A.

FIG. 3A is an electrical schematic of the array seen in FIGS. 2A and 2B.

FIG. 3B is a circuit diagram depicting a number of NAND arrays such theone seen in FIGS. 2A and 2B, with each array controlled by a set ofcommon word lines.

FIG. 4A is a cross section of prior art device 200.

FIG. 4B is a cross section of prior art device 300.

FIGS. 5A-5D illustrate device 100 at various stages during fabricationof the device.

FIGS. 6A and 6B illustrate different embodiments of booster plate 110.

FIG. 6C illustrates a mask used in making booster plate 110.

DESCRIPTION

The boosting structure and routines utilized in the present invention,generally speaking, make it possible to scale down a memory array orstructure, and also result in more reliable reading and writing of datawithin such a structure. The structure provides increased capacitivecoupling where needed, while at the same time avoids the consequence ofhaving an increased capacitive coupling where it is detrimental tooperations. In particular, as compared to a prior solution incorporatinga booster plate, control gate (wordline) capacitance is reduced bynearly 80%, which reduces the wordline to wordline coupling and theunwanted noise associated with it. As compared to prior solutionswithout a booster plate, floating gate to floating gate coupling in thewordline direction is virtually eliminated.

FIG. 1 illustrates a cross section of memory structure or device 100, anembodiment of the present invention. The cross section is takenperpendicular to the direction or axes of the wordlines, and would beparallel to section A-A discussed with regard to the prior art describedand shown in FIG. 2A. A number of control gates 112, also known aswordlines are illustrated in this cross section. The center wordline isreferenced as the “nth” wordline and the position of the other wordlinesis noted in relation to the referenced wordline. Generally, when theprogramming operations will be discussed later, the “nth” wordline willdenote the selected wordline for a given operation.

As can be seen in FIG. 1, the wordlines 112 are above floating gates110. The fingers 110B of booster plate 110 are located in between thewordlines and floating gates. The booster plate fingers 110B extend fromthe bottom of the floating gates to the top of the wordlines. Thefingers do not extend past the level of the top of the wordlines 112 inFIG. 1. In other words, no portion of the booster plate 110 or fingers110B is located over or on top of the upper surface of the wordlines. Inthis or other embodiments, the fingers may have an upper surface that ishigher than an upper surface of the wordlines when measured a from fixedpoint of reference such as the substrate or a layer upon the substrate.However, this should not be taken to mean that the booster plate andfingers are located above or over the wordlines. The bottom of thebooster plate 110 is at the same level as the bottom of the floatinggates 110. This can be at the top level 118A of substrate 118, althoughoften there may be one more other layers between the bottom of thefloating gates 110 and the top of the substrate 118. The layers may alsobe present between the bottom of the booster plate 110 and the top ofthe substrate 118. This cross section is taken in the middle of thearray, in a location where the fingers 110B are not connected. Althoughit cannot be seen in this cross section, the fingers of the boosterplate are all tied to a linking portion of the booster plate at theperiphery of the device, as can be seen in FIGS. 6A and 6B. The linkingportion can be thought of as type of electrical bus. That is to say, theentire booster plate 110 is conductive, and a voltage applied to thelinking portion will be distributed to each of the fingers 110B. FIG. 4Aillustrates a cross section of prior device 200, which is similar todevice 100 but lacks the booster plate. Fingers 110B of the boosterplate 110 result in a near elimination of the floating gate to floatinggate coupling present in the prior device 200. This minimizes disturbsand allows the usage of lower voltage levels in various operations,which further allows for scaling down of the device.

Because the booster plate 110 in device 100 does not extend above thewordlines, there will be limited if any coupling to the top portion ofthe wordlines. This is in contrast to the prior art device 300 shown inFIG. 4B. In FIG. 4B, the portion of device 300 illustrated in this crosssection is structurally similar to that shown in FIG. 1 with theexception of the booster plate. Booster plate 111 of device 300 has asolid upper plate portion 111B present above the top surface ofwordlines 112. Essentially, the booster plate 111 in device 300 coversthe wordlines and floating gates of the memory array like a (continuous)blanket. This provides a high level of coupling between plate 111 andthe control gates 112 and floating gates 116. However, as will bediscussed later, such a high degree of coupling is not advantageousbecause it dramatically increases the overall wordline or control gatecapacitance. As can be seen in Table M.2, the total control gatecapacitance in device 300 is 78% higher than that of device 200 and 42%higher than in device 100 embodying the present invention. Control gate(“CG”) coupling presents noise problems in read and write operations andis therefore undesirable. This is especially a problem in multi-levelmemories, where the degree for error is quite low, and getting lowereveryday. Furthermore, minimizing the noise and interference fromexcessive control gate coupling is key in reducing the scale andincreasing the capacity of these flash devices.

Table M.1 below shows the relative floating gate (“FG”) capacitancevalues for device 100 of the present invention versus prior art devices200 and 300. As can be seen, the FG-FG coupling and FG-CG coupling isreduced to zero percent in the wordline direction. The FG-FG coupling isalso slightly reduced in the bitline (“BL”) direction due to theincreased overall capacitance.

TABLE M.1 FG capacitance 200 300 100 FGn-CGn Ccg 50.0% 50.0% 50.0%FGn-CGn + 1 2.0% 0.0% 0.0% FGn-CGn − 1 2.0% 0.0% 0.0% FGn-FGn − 1 4.0%0.0% 0.0% FGn-FGn + 1 4.0% 0.0% 0.0% FGn-CHANNELn Cch 34.0% 34.0% 34.0%FGn-S/D 2.0% 0.0% 0.0% FGn-FGm 2.0% 2.0% 2.0% (BL direction) FGn-BoosterCsn 0.0% 30.0% 30.0% Total Cfgtotal 100.0% 116.0% 116.0%

Table M.2 below illustrates the CG capacitance values for device 100 ofthe present invention versus prior art devices 200 and 300. As can beseen in Table M.2, the total control gate capacitance in device 300 is78% higher than that of device 200 and 42% higher than in device 100embodying the present invention. As mentioned above, this dramaticincrease in capacitance presents noise problems in read and writeoperations and is therefore undesirable.

TABLE M.2 CG Capacitance 200 300 100 CGn-FGn 52.0% 52.0% 52.0% CGn-FGn +1 2.5% 0.0% 0.0% CGn-FGn − 1 2.5% 0.0% 0.0% CGn-CGn − 1 21.0% 0.0% 0.0%CGn-CGn + 1 21.0% 0.0% 0.0% CGn-S/D 1.0% 0.0% 0.0% CGn-Booster 0.0%126.0% 84.0% Total 100.0% 178.0% 136.0%Read Operations

In order to help in understanding the operation and advantages of thepresent invention, some examples of voltages used in read operations areshown in the tables below. It should be understood that these are onlyillustrative examples or embodiments and other values can of course beused with the present invention. Vplate is the voltage applied tobooster plate 110.

During Read Operation: Case 1: WL0 Vread WL1 Vread WLn − 2 Vread WLn − 1Vread Sel WLn 0 V WLn + 1 Vread WLn + 2 Vread WL30 Vread WL31 VreadVplate Vread Case 2: WL0 Vread WL1 Vread WLn − 2 Vread WLn − 1 Vread SelWLn 0 V WLn + 1 Vread WLn + 2 Vread WL30 Vread WL31 Vread Vplate Vread +Beta

In case 2, Beta is preferably about 0.5 volts. The operation of case 2minimizes read disturb issues because when the Vplate potential isincreased by Beta, the Vpass value on the unselected WLs can be reducedto a level that eliminates or at least minimizes the Vread disturbeffect for the unselected WLs. This reduction is possible because of thecapacitive coupling effect between the fingers of the booster plate andmemory cell-floating gates.

Program Operations

The memory cells of device 100 can be programmed in many different ways.Booster plate 110 can be biased at different voltage levels fordifferent cells or floating gates during operations, e.g. for a programoperation. And of course, the voltage level of a selected wordline (andassociated selected floating gate(s)) and unselected wordlines can alsobe varied. Use of the booster plate 110, with its fingers 110B thatdon't rise above the upper level or surface of the wordlines, allows formore precise and effective boosting control than in prior devices, forexample, device 300.

A self boost (“SB”) mode, local self boost (“LSB”) mode, and erase areaself boost (“EASB”) mode will now be described. Other variations andmodes may also be used with the structure of the present invention.Currently, the SB and EASB modes are preferable for use within device100.

Self Boost Mode

Examples of the Vplate bias potential during the SB mode are shown belowfor two different cases or scenarios.

TABLE SB1 During Programming Operations: SB Mode (Self Boost) Case 1:WL0 Vpass WL1 Vpass WLn − 2 Vpass WLn − 1 Vpass Sel WLn VPGM WLn + 1Vpass WLn + 2 Vpass WL30 Vpass WL31 Vpass Vplate Vpass~8v

Biasing the booster plate 110 with the Vpass voltage level provides avery high self boosting potential.

TABLE SB2 SB Mode (Self Boost) Case 2: WL0 Vpass WL1 Vpass WLn − 2 VpassWLn − 1 Vpass Sel WLn VPGM WLn + 1 Vpass WLn + 2 Vpass WL30 Vpass WL31Vpass Vplate Vpass + Alpha

Although biasing the booster plate with the Vpass voltage level providesgood self boosting, in order to minimize the disturb that may resultfrom the Vpass voltage applied to unselected wordlines, it is desirableto minimize the Vpass level. The level of Vpass can be reduced byincreasing the voltage Vplate applied to the booster plate by someamount Alpha. This is due to the coupling between the booster plate andthe cell floating gates. Preferably, Alpha is about 0.5 volts in thecurrent embodiment, but it can range up to several volts. Alpha will beselected based upon the particular structure of the device in order tominimize or eliminate the Vpass disturb effect.

As can be seen in the following tables, in comparison with prior device200, both self boosting cases allow for the program voltage Vpgm to bereduced while still applying the same voltage to the floating gate (e.g.10v). As mentioned previously, this is beneficial for reducing disturbsand other unwanted coupling effects.

TABLE SB3 Program Operation SB mode 100 200 case 1 case 2 SGD VDD VDDVDD SGS   0 v VSG VSG Selected WL VPGM1 VPGM2 VPGM3 Unselected VPASS1VPASS2 VPASS3 WL Selected BL   0 v   0 v   0 v Unselected BL VDD VDD VDDSource ~1 v ~1 v ~1 v Pwell   0 v   0 v   0 v Booster Plate N.A VPASS2VPASS3 + a VDD: ~2 v VPGM1: ~20 v VPASS1: ~8 v VPGM2: ~16.7 v VPASS2: ~8v VPGM3: ~16.3 v VPASS3: ~8 v a: ~0.5 v (VPGM2 < VPGM1) (VPGM3 < VPGM2)

TABLE SB4 200 Selected Cell FG voltage = VPGM1 × Ccg/Cfgtotal    20 v ×0.5 = 10 v 100 Selected Cell FG voltage = VPGM2 × Ccg/Cfgtotal + VPASS2× Csp/Cfgtotal case1 16.7 v × (0.5/1.16) + 8 × (0.3/1.16) = 10 v 100Selected Cell FG voltage = VPGM3 × Ccg/Cfgtotal + (VPASS3 + a) ×Csp/Cfgtotal case2 16.3 v × (0.5/1.16) + (8 + 0.5) × (0.3/1.16) = 10 v

Local Self Boost Mode

While the SB mode and EASB mode are preferred, the LSB mode can also beimplemented in or used with device 100. In the LSB mode a positivevoltage is not applied to the booster plate in order to isolate theselected cell from other cells.

TABLE LSB 1 LSB Mode (Local Self Boost): WL0 Vpass WL1 Vpass WLn − 2Vpass WLn − 1 0 V Sel WLn VPGM WLn + 1 0 V WLn + 2 Vpass WL30 Vpass WL31Vpass Vplate 0 V

Erase Area Self Boost Mode

In the EASB mode the booster plate voltage can vary depending on whichwordline is being programmed. There is no limit to the possiblevariations of voltages applied on different wordlines and the boosterplate, especially given that the number of cells in a given NAND stringand the associated wordlines are prone to increase over time. However,some examples will be given for a cell having 32 wordlines. In oneexample, the Vpgm voltages applied at the various wordlines can linearlyincrease or decrease from the first wordline to the last wordline(“WL”).

In another example, for lower WLs such as WL0 to WL3, while beingprogrammed at Vpgm, the booster plate voltage Vplate can range up to theVpass value. For middle WLs such as WL4 to WL27, while being programmedat Vpgm, the booster plate voltage Vplate is at or around the Vreadvalue. For higher WLs such as WL28 to WL31, while being programmed atVpgm, the booster plate voltage Vplate can be at or around the 0V value.

EASB Case 1

In EASB case 1, a voltage of approximately Vread is placed on thebooster plate 110, as seen in the tables below. In comparison to theprior design 200 lacking the booster plate, the level of Vpgm is less.Again, this is advantageous in lessening disturbs and other unwantedcoupling.

TABLE EASB 1.1 Program Operation EASB mode 100 200 case 1 SGD VDD VDDSGS   0 v VSG Unselected WL max VPASS1 VPASS2 Unselected WLn + 2 VPASS1VPASS2 Unselected WL + 1 VPASS1 VPASS2 Selected WLn VPGM1 VPGM2Unselected WLn − 1   0 v   0 v Unselected WLn − 2 VPASS1 VPASS2Unselected WL 0 VPASS1 VPASS2 Selected BL   0 v   0 v Unselected BL VDDVDD Source ~1 v ~1 v Pwell   0 v   0 v Booster Plate N.A. VREAD2 VDD: ~2v VPGM1: ~20 v VPASS1: ~8 v VPGM2: ~19.2 v VPASS2: ~8 v VREAD2: ~5 v(VPGM2 < VPGM1)

TABLE EASB 1.2 200 Selected Cell FG voltage = VPGM1 × Ccg/Cfgtotal    20v × 0.5 = 10 v 100 Selected Cell FG voltage = VPGM2 × Ccg/Cfgtotal +VPASS2 × Csp/Cfgtotal 19.2 v × (0.5/1.16) + 5 × (0.3/1.16) = 10 v

EASB Case 2

Case 2 of the EASB mode improves upon EASB case 1 and is the preferredEASB mode. This is because lower program voltages can be used for manyof the programming operations. While in some instances a higher programvoltage is used, as compared to what would be used by device 200 withouta booster plate, overall, the use of this EASB programming mode with thecurrent booster plate 110 is desirable.

TABLE EASB 2.1 Program Operation EASB mode 100 200 case 2 all WLs WL0WLcenter WLmax SGD VDD VDD VDD VDD SGS   0 v VSG VSG VSG Unselected WLVPASS1 VPASS2 VPASS2 VPASS2 max Unselected VPASS1 VPASS2 VPASS2 VPASS2WLn + 2 Unselected VPASS1 VPASS2 VPASS2 VPASS2 WLn + 1 Selected WLnVPGM1 VPGM2_0 VPGM2_cen VPGM2_max Unselected   0 v   0 v   0 v   0 v WLn− 1 Unselected VPASS1 VPASS2 VPASS2 VPASS2 WLn − 2 Unselected WL 0VPASS1 VPASS2 VPASS2 VPASS2 Selected BL   0 v   0 v   0 v   0 vUnselected BL VDD VDD VDD VDD Source ~1 v ~1 v ~1 v ~1 v Pwell   0 v   0v   0 v   0 v Booster Plate N.A. VPASS2 VREAD2   0 v

TABLE EASB 2.2 VDD: ~2 v VPGM1: ~20 v VPASS1: ~8 v VPGM2_0: ~16.7 vVPGM2_cen: ~19.2 v VPGM2_max: ~23.2 v VPASS2: ~8 v VREAD2: ~5 v

TABLE EASB 2.3 200 Selected Cell FG voltage = VPGM1 × Ccg/Cfgtotal   20v × 0.5 = 10 v 100 Selected Cell FG voltage = VPGM2 × Ccg/Cfgtotal +case2 VPASS2 × Csp/Cfgtotal WL0 16.7 v × (0.5/1.16) + 8 × (0.3/1.16) =10 v 100 Selected Cell FG voltage = VPGM2 × Ccg/Cfgtotal + case2 VPASS2× Csp/Cfgtotal WL_cen 19.2 v × (0.5/1.16) + 5 × (0.3/1.16) = 10 v 100Selected Cell FG voltage = VPGM3 × Ccg/Cfgtotal + case2 (VPASS3 + a) ×Csp/Cfgtotal WL_max 23.2 v × (0.5/1.16) + 0 × (0.3/1.16) = 10 vFabrication

Device 100 and other embodiments of the present invention can be made ina number of ways. One way to make such a device is described below, forillustrative purposes.

FIGS. 5A-5D illustrate device 100 at various stages during fabricationof the device. The standard NAND fabrication processes are used to makethe memory array structure underlying the boron phosphorous siliconglass (“BPS G”) layer 150 deposited upon the structure, as seen in FIG.5A. After it is deposited, there are two options. In option 1, it isleft unpolished. In option two, the BPSG layer undergoes chemicalmechanical polishing (“CMP”). About 1000 angstroms of the layer are leftover the gate structure after the CMP. The resultant structure is seenin FIG. 5B.

Next, a mask is applied before the BPSG layer 150 is etched for oxideremoval. Once the mask in place the oxide is etched. Any known etchingmethod can be implemented but reactive ion etching or HF vapor etchingare preferred. About 7000 angstroms of the BPSG will be removed, butfull oxide islands will be kept in the SG areas, and full oxide will beleft in the periphery to keep the periphery circuit intact. Then thephoto resist of the mask will be removed and the structure cleaned,followed by a post barrier SiN oxidation step. The resultant structureis shown in FIG. 5C.

Next, a mask with a pattern such as that seen in FIG. 6C is made uponthe structure. An RIE or HF wet etch or equivalent is performed and theBPSG is etched in the wordline area. If RIE is employed, the sides ofthe wordlines will have silicon oxide, and the thickness of the bottomof the oxide can be controlled. In the case of an HF etch, silicondioxide is etched and an additional dielectric may be deposited incertain embodiments. Optionally, a thick layer of approximately fivenanometers of SiN or SiO may be deposited after the etch.

Next, a layer of tungsten or poly or another equivalent material isdeposited. This layer is about 500 angstroms thick, for example. It isthen chemically mechanically polished to the level of the gate barriernitride. This is followed by TEOS deposition. After that, a(photolithographic) contact mask pattern is made (patterned and etched)for the bitline contact 154 and periphery contact 158. Alternatively, atwo step mask and mask etch process can be utilized rather than a onestep process. After that, another layer of tungsten or poly is depositedand etched back. Then another mask is made for a metallic layer and aTEOS etch is performed. The metal (tungsten, aluminum, or copper etc.)is deposited and then chemically mechanically polished. The resultantstructure can be seen in FIG. 5D. Booster plate 110 can be seen betweenthe various memory cells.

FIGS. 6A and 6B illustrate different embodiments of booster plate 110.As mentioned previously, booster plate 110 comprises fingers 110B andlinking or connecting portion 110A. Plate 110 is connected to thebooster plate transistor 120 and in turn to the control circuitry of thedevice.

1. A flash memory device formed from a substrate, the device comprising:strings of transistors of a NAND architecture comprising a first selectgate, a plurality of floating gates, and a second select gate; aplurality of wordlines perpendicular to the axes of the strings, eachwordline of the plurality situated above floating gates of the strings;and a booster plate comprising a plurality of fingers and a portionlinking the fingers, the fingers running parallel to the wordlines andlocated between adjacent wordlines, the plurality of wordlines having atop surface approximately a distance from a reference plane that isparallel to the top surfaces of the wordlines, the plurality of fingershaving a top surface also approximately the distance from the referenceplane, a floating gate associated with a selected word line of theplurality of word lines is read by applying a first voltage to theselected word line while applying a read voltage to unselected wordlines of the plurality of word lines while applying a voltage higherthan the read voltage to the booster plate.
 2. The flash memory deviceof claim 1, wherein the fingers of the plurality extend between floatinggates under the wordlines.
 3. The flash memory device of claim 2,wherein the fingers extend from a bottom surface of the floating gatesto the top surface of the wordlines.
 4. The flash memory device of claim1, wherein the booster plate is biased during operations of the devicein order to minimize the effect of disturbs.
 5. A flash memory deviceformed from a substrate, the device comprising: strings of transistorsof a NAND architecture comprising a first select gate, a plurality offloating gates, and a second select gate; a plurality of wordlinesperpendicular to the axes of the strings, each wordline of the pluralitysituated above floating gates of the strings the word lines each havinga top surface, the floating gates each having a bottom and, a boosterplate comprising a plurality of fingers, the booster plate extends fromthe bottoms of the floating gates to the top surfaces of the wordlinesbut does not extend over the top surfaces of the wordlines, a floatinggate associated with a selected word line of the plurality of word linesis programmed by applying a program voltage to said selected word linewhile applying a pass voltage to unselected word lines of the pluralityof word lines while applying a voltage higher than the pass voltage tothe booster plate.
 6. A flash memory device formed from a substrate, thedevice comprising: strings of transistors of a NAND architecturecomprising a first select gate, a plurality of floating gates, and asecond select gate; a plurality of control gates, each control gate ofthe plurality situated above floating gates of the string, the controlgates each having a top surface, the floating gates each having a bottomand a booster plate comprising a plurality of fingers the booster plateextends from the bottoms of the floating gates to the top surfaces ofthe control gates but does not extend over tops surfaces of the controlgate, a floating gate associated with a selected word line of theplurality of word lines is programmed by applying a program voltage tosaid selected word line while applying a bias voltage to the boosterplate, the program voltage depending on the position of the selectedword line, the bias voltage depending on the position of the selectedword line.
 7. The flash memory of claim 3, wherein the fingers have awidth that is substantially uniform from the top surface of thewordlines to a bottom portion of the floating gates.
 8. The flash memoryof claim 7, wherein the fingers do not extend over the top surface ofthe wordlines.
 9. The flash memory of claim 3, wherein the fingers donot extend over the top surface of the wordlines.
 10. The flash memoryof claim 5, wherein the fingers have a width that is substantiallyuniform from the top surface of the wordlines to a bottom portion of thefloating gates.
 11. The flash memory device of claim 5, wherein thebooster plate is biased during operations of the device in order tominimize the effect of disturbs.
 12. The flash memory of claim 6,wherein the fingers have a width that is substantially uniform from topsurfaces of the control gates to bottom portions of the floating gates.13. The flash memory device of claim 6, wherein the booster plate isbiased during operations of the device in order to minimize the effectof disturbs.